JPH0442739U - - Google Patents
Info
- Publication number
- JPH0442739U JPH0442739U JP8367890U JP8367890U JPH0442739U JP H0442739 U JPH0442739 U JP H0442739U JP 8367890 U JP8367890 U JP 8367890U JP 8367890 U JP8367890 U JP 8367890U JP H0442739 U JPH0442739 U JP H0442739U
- Authority
- JP
- Japan
- Prior art keywords
- package
- metal layer
- brazing material
- metallized metal
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005219 brazing Methods 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8367890U JP2515051Y2 (ja) | 1990-08-07 | 1990-08-07 | 半導体素子収納用パッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8367890U JP2515051Y2 (ja) | 1990-08-07 | 1990-08-07 | 半導体素子収納用パッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0442739U true JPH0442739U (en]) | 1992-04-10 |
| JP2515051Y2 JP2515051Y2 (ja) | 1996-10-23 |
Family
ID=31631542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8367890U Expired - Lifetime JP2515051Y2 (ja) | 1990-08-07 | 1990-08-07 | 半導体素子収納用パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2515051Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06120363A (ja) * | 1992-10-07 | 1994-04-28 | Kyocera Corp | 半導体素子収納用パッケージ |
-
1990
- 1990-08-07 JP JP8367890U patent/JP2515051Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06120363A (ja) * | 1992-10-07 | 1994-04-28 | Kyocera Corp | 半導体素子収納用パッケージ |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2515051Y2 (ja) | 1996-10-23 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |